MC74HC132AND
vs
HD74HC132P-E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
RENESAS ELECTRONICS CORP
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
31 ns
Schmitt Trigger
YES
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Family
HC/UH
Length
19.2 mm
Moisture Sensitivity Level
1
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
125 ns
Qualification Status
Not Qualified
Seated Height-Max
5.06 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Width
7.62 mm