MC74HC132AND vs HD74HC132P-E feature comparison

MC74HC132AND Freescale Semiconductor

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HD74HC132P-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS RENESAS ELECTRONICS CORP
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Family HC/UH
Length 19.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 125 ns
Qualification Status Not Qualified
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Width 7.62 mm

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