MC74HC132AND vs MC74HC00ADR2G feature comparison

MC74HC132AND Motorola Mobility LLC

Buy Now Datasheet

MC74HC00ADR2G Rochester Electronics LLC

Buy Now Datasheet
Pbfree Code No No
Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 HALOGEN FREE AND ROHS COMPLIANT, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Length 18.86 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 38 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Seated Height-Max 4.69 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 3 2
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74HC132AND with alternatives

Compare MC74HC00ADR2G with alternatives