MC74HC132AND vs MC74HC132ADR2 feature comparison

MC74HC132AND Freescale Semiconductor

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MC74HC132ADR2 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 SOIC-14
Reach Compliance Code unknown unknown
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 151.15
CO2e (mg) 20219.441 1874.26
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 31 ns
Schmitt Trigger YES
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 5
Pbfree Code No
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 190 ns
Qualification Status COMMERCIAL
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm