MC74HC132AND
vs
MM54HC132J/883C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T14
R-CDIP-T14
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
31 ns
Schmitt Trigger
YES
YES
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
HTS Code
8542.39.00.01
Family
HC/UH
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
186 ns
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class C
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Width
7.62 mm
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