MC74HC138AF vs TC74HC138AF(TP1) feature comparison

MC74HC138AF onsemi

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TC74HC138AF(TP1) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.3 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family HC/UH HC/UH
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 10.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 41 ns
Propagation Delay (tpd) 205 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.3 mm
Base Number Matches 4 3
Pbfree Code No
Additional Feature 3 ENABLE INPUTS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC138AF with alternatives

Compare TC74HC138AF(TP1) with alternatives