MC74HC175N vs M38510/30107BEX feature comparison

MC74HC175N onsemi

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M38510/30107BEX YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI PHILIPS COMPONENTS
Package Description DIP-16 DIP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Family LS
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 55 ns
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
fmax-Min 25 MHz

Compare MC74HC175N with alternatives

Compare M38510/30107BEX with alternatives