MC74HC175N vs TC74HCT273AFW-TP1 feature comparison

MC74HC175N onsemi

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TC74HCT273AFW-TP1 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI TOSHIBA CORP
Package Description DIP-16 SOP,
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDSO-G20
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Number of Functions 4 1
Number of Terminals 16 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 235 240
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 1 3
Pbfree Code No
Part Package Code SOIC
Pin Count 20
Family HCT
Length 12.8 mm
Number of Bits 8
Output Polarity TRUE
Propagation Delay (tpd) 38 ns
Seated Height-Max 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm
fmax-Min 24 MHz

Compare MC74HC175N with alternatives

Compare TC74HCT273AFW-TP1 with alternatives