MC74HC257ND vs 5962R9580501VX feature comparison

MC74HC257ND Motorola Mobility LLC

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5962R9580501VX Intersil Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC HARRIS SEMICONDUCTOR
Part Package Code DIP DIE
Package Description DIP, DIP16,.3 DIE,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 S-XUUC-N16
JESD-609 Code e0 e0
Length 19.175 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE UNCASED CHIP
Propagation Delay (tpd) 30 ns 37 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 7.62 mm
Base Number Matches 3 2
Total Dose 100k Rad(Si) V

Compare MC74HC257ND with alternatives

Compare 5962R9580501VX with alternatives