MC74HC4040AF
vs
TC74HC4040FW
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.3
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Count Direction |
UP
|
UP
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
10.3 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Load/Preset Input |
NO
|
YES
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
|
| Max I(ol) |
0.004 A
|
|
| Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
115 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
1.9 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
NEGATIVE EDGE
|
NEGATIVE EDGE
|
| Width |
5.275 mm
|
5.3 mm
|
| fmax-Min |
40 MHz
|
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare MC74HC4040AF with alternatives
Compare TC74HC4040FW with alternatives