MC74HC4050DDR2 vs 74HC4050D,652 feature comparison

MC74HC4050DDR2 Motorola Semiconductor Products

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74HC4050D,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description SOP, SO-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CMOS-TTL LEVEL TRANSLATOR CMOS-TTL LEVEL TRANSLATOR
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 26 ns 26 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOP
Pin Count 16
Manufacturer Package Code SOT109-1
ECCN Code EAR99
JESD-609 Code e4
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 26 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74HC4050DDR2 with alternatives

Compare 74HC4050D,652 with alternatives