MC74HC541AN vs TC74HC541AF feature comparison

MC74HC541AN onsemi

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TC74HC541AF Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-20 SOP, SOP20,.3
Pin Count 20 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer onsemi Toshiba
Control Type ENABLE LOW ENABLE LOW
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T20 R-PDSO-G20
JESD-609 Code e0
Length 26.415 mm 12.8 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3 SOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 235 NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns 23 ns
Propagation Delay (tpd) 165 ns 165 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.8 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 5.3 mm
Base Number Matches 2 20
Packing Method TUBE

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