MC74HC541ND
vs
TC74HC541AP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
TOSHIBA CORP
|
| Package Description |
DIP, DIP20,.3
|
0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Control Type |
ENABLE LOW
|
ENABLE LOW
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.006 A
|
0.006 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
2/6 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
20
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Toshiba
|
| Family |
|
HC/UH
|
| Length |
|
24.6 mm
|
| Load Capacitance (CL) |
|
150 pF
|
| Number of Ports |
|
2
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Prop. Delay@Nom-Sup |
|
23 ns
|
| Propagation Delay (tpd) |
|
165 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.45 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
Compare TC74HC541AP with alternatives