MC74HCT00ADR2 vs SN74HCT00DTG4 feature comparison

MC74HCT00ADR2 Motorola Mobility LLC

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SN74HCT00DTG4 Texas Instruments

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Propagation Delay (tpd) 28 ns 25 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 3 1
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns
Time@Peak Reflow Temperature-Max (s) 30

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