MC74HCT00ADR2G vs GD74HC00 feature comparison

MC74HCT00ADR2G Motorola Mobility LLC

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GD74HC00 SK Hynix Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC SK HYNIX INC
Part Package Code SOIC
Package Description SOP, DIP-14
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 28 ns 115 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 2 4
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)

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