MC74LCX02DTG vs IDT74LVC02APG feature comparison

MC74LCX02DTG

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IDT74LVC02APG Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP
Package Description TSSOP, TSSOP14,.25
Pin Count 14
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G14
JESD-609 Code e0
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 4.4 ns
Propagation Delay (tpd) 5.4 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2

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