MC74LCX138DT vs CD4543BF feature comparison

MC74LCX138DT onsemi

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CD4543BF Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR INTERSIL CORP
Part Package Code TSSOP DIP
Package Description TSSOP, TSSOP16,.25 HERMETIC SEALED, CERAMIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 3 ENABLE INPUTS
Family LVC/LCX/Z 4000/14000/40000
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G16 R-CDIP-T16
JESD-609 Code e4 e0
Length 5 mm
Logic IC Type 3-LINE TO 8-LINE DECODER SEVEN SEGMENT DECODER/DRIVER
Max I(ol) 0.024 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED CONFIGURABLE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 7.2 ns 1200 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 3.6 V 18 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 4 3

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Compare CD4543BF with alternatives