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MC74LCX138DT vs 74LVC138APW,112 feature comparison

MC74LCX138DT Motorola Mobility LLC

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74LVC138APW,112 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP16,.25 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.024 A 0.024 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP16,.25 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 6 ns 7.5 ns
Propagation Delay (tpd) 7 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 5 2
Rohs Code Yes
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
Input Conditioning STANDARD
Moisture Sensitivity Level 1
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Logic » Decoder/Drivers
Logic » Decoder/Drivers

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Compare 74LVC138APW,112 with alternatives