MC74LCX157MR2 vs 74LCX257MTCX feature comparison

MC74LCX157MR2 Motorola Mobility LLC

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74LCX257MTCX Fairchild Semiconductor Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC TSSOP
Package Description SOP, 4.40 MM, MO-153, TSSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.2 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.275 mm 4.4 mm
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 16 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
ECCN Code EAR99
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code TSSOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 7.2 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74LCX157MR2 with alternatives

Compare 74LCX257MTCX with alternatives