MC74LCX157MR2 vs NC7SZ157L6X feature comparison

MC74LCX157MR2 Motorola Mobility LLC

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NC7SZ157L6X Fairchild Semiconductor Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC MICROPAK MLP
Package Description SOP, 1 MM, MICROPAK-6
Pin Count 16 6
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-XDSO-N6
Length 10.2 mm 1.45 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 6
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 0.55 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Width 5.275 mm 1 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
ECCN Code EAR99
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 5 ns
Propagation Delay (tpd) 10.5 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74LCX157MR2 with alternatives

Compare NC7SZ157L6X with alternatives