MC74LCX258DTEL vs SN74LVC257ANSRE4 feature comparison

MC74LCX258DTEL Motorola Mobility LLC

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SN74LVC257ANSRE4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TEXAS INSTRUMENTS INC
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 10.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 9 ns 13.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.3 mm
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 4.6 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74LCX258DTEL with alternatives

Compare SN74LVC257ANSRE4 with alternatives