MC74LVX138DT
vs
CD54HC237F3A
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
LV/LV-A/LVX/H
|
HC/UH
|
Input Conditioning |
STANDARD
|
LATCHED
|
JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
JESD-609 Code |
e4
|
e0
|
Length |
5 mm
|
|
Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
Max I(ol) |
0.004 A
|
0.004 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
DIP
|
Package Equivalence Code |
TSSOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
14 ns
|
48 ns
|
Propagation Delay (tpd) |
20 ns
|
240 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
4.5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
|
Base Number Matches |
3
|
1
|
Additional Feature |
|
ADDRESS LATCHES
|
Load Capacitance (CL) |
|
50 pF
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare MC74LVX138DT with alternatives
Compare CD54HC237F3A with alternatives