MC74LVX138DT vs CD54HC237F3A feature comparison

MC74LVX138DT onsemi

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CD54HC237F3A Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI HARRIS SEMICONDUCTOR
Part Package Code TSSOP
Package Description TSSOP-16 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LV/LV-A/LVX/H HC/UH
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e4 e0
Length 5 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 14 ns 48 ns
Propagation Delay (tpd) 20 ns 240 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm
Base Number Matches 3 1
Additional Feature ADDRESS LATCHES
Load Capacitance (CL) 50 pF
Screening Level 38535Q/M;38534H;883B

Compare MC74LVX138DT with alternatives

Compare CD54HC237F3A with alternatives