MC74VHC08MR2 vs TC74LVX08FEL feature comparison

MC74VHC08MR2 onsemi

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TC74LVX08FEL Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA AMERICA ELECTRONIC COMPONENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family AHC/VHC LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 10.2 mm 10.3 mm
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 14 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.3 mm
Base Number Matches 1 5
Pbfree Code No
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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