MC74VHC1G32DBVT1G vs MC74HC1G32DTT2 feature comparison

MC74VHC1G32DBVT1G onsemi

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MC74HC1G32DTT2 Motorola Mobility LLC

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI MOTOROLA INC
Manufacturer Package Code 318BQ
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family AHC/VHC HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 3 mm 3 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP TSOP
Package Equivalence Code TSOP5/6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 10 ns
Propagation Delay (tpd) 15.5 ns 155 ns
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.5 mm 1.5 mm
Base Number Matches 1 1
Part Package Code TSOP
Package Description TSOP,
Pin Count 5
Qualification Status Not Qualified

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