MC74VHC257MELG vs 74AHC157BQ feature comparison

MC74VHC257MELG onsemi

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74AHC157BQ NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code SOIC QFN
Package Description SOP, SOP16,.3 HVQCCN, LCC16,.1X.14,20
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PQCC-N16
JESD-609 Code e4 e4
Length 10.2 mm 3.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.008 A 0.008 A
Moisture Sensitivity Level 3 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Equivalence Code SOP16,.3 LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 14.5 ns 21.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Width 5.275 mm 2.5 mm
Base Number Matches 1 3
Pbfree Code Yes
Prop. Delay@Nom-Sup 11 ns
Time@Peak Reflow Temperature-Max (s) 30

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