MC74VHC257MELG vs 74HC157PW,112 feature comparison

MC74VHC257MELG onsemi

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74HC157PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description SOP, SOP16,.3 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 10.2 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.008 A 0.004 A
Moisture Sensitivity Level 3 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TUBE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 14.5 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.275 mm 4.4 mm
Base Number Matches 1 1
Manufacturer Package Code SOT403-1
Factory Lead Time 4 Weeks
Prop. Delay@Nom-Sup 38 ns
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC157PW,112 with alternatives