MC74VHC32DR2
vs
74AC32PW-T
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-14
|
TSSOP,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
AHC/VHC
|
AC
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Length |
8.65 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Max I(ol) |
0.008 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Prop. Delay@Nom-Sup |
8.5 ns
|
|
| Propagation Delay (tpd) |
13 ns
|
6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare MC74VHC32DR2 with alternatives
Compare 74AC32PW-T with alternatives