MC74VHC32DR2G vs HD74LV32AFP-E feature comparison

MC74VHC32DR2G onsemi

Buy Now Datasheet

HD74LV32AFP-E Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ONSEMI RENESAS ELECTRONICS CORP
Part Package Code SOIC-14 NB SOIC
Package Description SOIC-14 SOP,
Pin Count 14 14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family AHC/VHC LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e6
Length 8.65 mm 10.06 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 8.5 ns
Propagation Delay (tpd) 13 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 5.5 mm
Base Number Matches 1 1
Rohs Code Yes

Compare MC74VHC32DR2G with alternatives

Compare HD74LV32AFP-E with alternatives