MC75174BDWR2 vs DS96F174MMW8 feature comparison

MC75174BDWR2 onsemi

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DS96F174MMW8 National Semiconductor Corporation

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Pbfree Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC-20 WB
Package Description SOP, SOP20,.4 DIE, WAFER
Pin Count 20
Manufacturer Package Code 751D-05
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer onsemi
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard V.11; X.27; EIA-422-A; EIA-485 EIA-422; EIA-485
JESD-30 Code R-PDSO-G20 X-XUUC-N
JESD-609 Code e0
Length 12.8 mm
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Terminals 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Out Swing-Min 1.5 V 1.5 V
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP20,.4 WAFER
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Seated Height-Max 2.65 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transmit Delay-Max 25 ns 25 ns
Width 7.5 mm
Base Number Matches 2 1
Screening Level 38535Q/M;38534H;883B

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