MC9S08AC96CFGE
vs
ST72F345K2T6
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
HCS08
|
|
| Clock Frequency-Max |
40 MHz
|
16 MHz
|
| DMA Channels |
NO
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
34
|
28
|
| Number of Terminals |
44
|
32
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LQFP
|
| Package Equivalence Code |
QFP44,.47SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
6144
|
|
| ROM (words) |
98304
|
|
| ROM Programmability |
FLASH
|
|
| Speed |
40 MHz
|
8 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
10 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
QFP
|
| Package Description |
|
7 X 7 MM, ROHS COMPLIANT, LQFP-32
|
| Pin Count |
|
32
|
|
|
|
Compare ST72F345K2T6 with alternatives