MC9S12E128MFUE vs MC9S12E128MFUE feature comparison

MC9S12E128MFUE Rochester Electronics LLC

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MC9S12E128MFUE NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description PLASTIC, QFP-80 PLASTIC, QFP-80
Pin Count 80
Reach Compliance Code unknown compliant
Has ADC YES YES
Address Bus Width
Bit Size 16 16
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels YES YES
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e3 e3
Length 14 mm 14 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 60 60
Number of Terminals 80 80
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 260 260
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 2.45 mm
Speed 25 MHz 25 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Additional Feature ALSO REQUIRES 3.3V OR 5V SUPPLY
Boundary Scan NO
On Chip Program ROM Width 8
Qualification Status Not Qualified
ROM (words) 131072

Compare MC9S12E128MFUE with alternatives

Compare MC9S12E128MFUE with alternatives