MCDM(R)-08-T
vs
SD08H0SBDR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SPC TECHNOLOGY/ MULTICOMP
|
C & K COMPONENTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.50.90.65
|
8536.50.90.65
|
| Additional Feature |
LOW PROFILE
|
APPROVAL: UL
|
| Body Breadth |
6.2 mm
|
6.68 mm
|
| Body Length or Diameter |
21.26 mm
|
21.79 mm
|
| Contact Current(DC)-Max |
0.025 A
|
0.1 A
|
| Contact (DC) Max Rating R Load |
.025A@24VDC
|
0.1A@25VDC
|
| Contact Voltage(DC)-Max |
24 V
|
25 V
|
| Electrical Life |
2000 Cycle(s)
|
2000 Cycle(s)
|
| Mounting Feature |
SURFACE MOUNT-STRAIGHT
|
SURFACE MOUNT-STRAIGHT
|
| Number of Switch Sections |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Sealing |
TOP TAPE SEALED
|
|
| Surface Mount |
NO
|
NO
|
| Switch Action |
LATCHED
|
LATCHED
|
| Switch Function |
SPST
|
SPST
|
| Switch Type |
SLIDE DIP SWITCH
|
SLIDE DIP SWITCH
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Actuator Material |
|
POLYAMIDE
|
| Actuator Type |
|
FLUSH TYPE
|
| Body Height |
|
4.31 mm
|
| Center Contact Material |
|
BERYLLIUM COPPER
|
| Center Contact Plating |
|
GOLD
|
| Contact Function |
|
OFF-ON
|
| Contact Resistance |
|
0.05 mΩ
|
| Dielectric Withstand Volts |
|
500VRMS V
|
| End Contact Material |
|
BERYLLIUM COPPER
|
| End Contact Plating |
|
GOLD
|
| Housing Material |
|
POLYPHTHALAMIDE
|
| Insulation Resistance |
|
1000000000 Ω
|
| Insulator Material |
|
POLYPHTHALAMIDE
|
| JESD-609 Code |
|
e3
|
| Packing Method |
|
TR, 13 INCH
|
| Terminal Finish |
|
Bright Tin (Sn)
|
| Terminal Material |
|
BRASS
|
|
|
|
Compare MCDM(R)-08-T with alternatives
Compare SD08H0SBDR with alternatives