MCIMX6X4EVM10AB
vs
AM4378BZDNA100
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
|
BGA
|
| Package Description |
|
LFBGA,
|
| Pin Count |
|
491
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
5A992.C
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-30 Code |
|
S-PBGA-B491
|
| JESD-609 Code |
|
e1
|
| Length |
|
17 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
491
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA491,25X25,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.3 mm
|
| Supply Voltage-Max |
|
1.378 V
|
| Supply Voltage-Min |
|
1.272 V
|
| Supply Voltage-Nom |
|
1.325 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
17 mm
|
| uPs/uCs/Peripheral ICs Type |
|
SoC
|
| Base Number Matches |
|
1
|
|
|
|
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