MCP1642BT-50I/MC
vs
MCP1642B-50I/MS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DFN-8
|
MSOP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
24 Weeks
|
23 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
4.2 V
|
4.2 V
|
| Input Voltage-Min |
2.5 V
|
2.5 V
|
| JESD-30 Code |
R-PDSO-N8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.8 A
|
0.8 A
|
| Output Voltage-Nom |
5 V
|
5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
TSSOP
|
| Package Equivalence Code |
SOLCC8,.08,20
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Switching Frequency-Max |
1150 kHz
|
1150 kHz
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
2 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP1642BT-50I/MC with alternatives
Compare MCP1642B-50I/MS with alternatives