MCP1651R-E/MS
vs
MCP1651ST-E/MS
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
PLASTIC, MO-187, MSOP-8
|
PLASTIC, MO-187, MSOP-8
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
4 Weeks
|
5 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
2.7 V
|
2.7 V
|
Input Voltage-Nom |
3.3 V
|
3.3 V
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Voltage-Max |
100 V
|
100 V
|
Output Voltage-Min |
3.3 V
|
3.3 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BOOST
|
BOOST
|
Switching Frequency-Max |
850 kHz
|
850 kHz
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MCP1651R-E/MS with alternatives
Compare MCP1651ST-E/MS with alternatives