MCP2021T-500E/MF
vs
MCP2021-330E/SN
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
SOIC
|
| Package Description |
6 X 5 MM, LEAD FREE, PLASTIC, DFN-8
|
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SOP
|
| Package Equivalence Code |
SOLCC8,.24
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
LIN TRANSCEIVER
|
LIN TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
5 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare MCP2021T-500E/MF with alternatives
Compare MCP2021-330E/SN with alternatives