MCP2022-500E/SL
vs
TJA1027TK/20/1J
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
HSOP,
|
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
NXP
|
| JESD-30 Code |
R-PDSO-G14
|
S-PDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
8.65 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
8
|
| Number of Transceivers |
1
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
TS 16949
|
AEC-Q100
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
LIN TRANSCEIVER
|
LIN TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
SOT782-1
|
| Factory Lead Time |
|
10 Weeks
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MCP2022-500E/SL with alternatives
Compare TJA1027TK/20/1J with alternatives