MCP2221-I/ST
vs
MCP2221T-I/ML
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SSOP-14
|
QFN-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Factory Lead Time |
9 Weeks
|
7 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
R-PDSO-G14
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
4 mm
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP14,.25
|
LCC16,.16SQ,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Current-Max |
15 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
4.4 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP2221-I/ST with alternatives
Compare MCP2221T-I/ML with alternatives