MCP23009-E/SO
vs
MCP23009-E/P
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOIC-18
|
DIP-18
|
Pin Count |
18
|
18
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Clock Frequency-Max |
10 MHz
|
10 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G18
|
R-PDIP-T18
|
JESD-609 Code |
e3
|
e3
|
Length |
11.55 mm
|
22.86 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
8
|
Number of I/O Lines |
8
|
8
|
Number of Ports |
8
|
8
|
Number of Terminals |
18
|
18
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP18,.4
|
DIP18,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
5.334 mm
|
Supply Current-Max |
1 mA
|
1 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.5 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
1
|
1
|
|
|
|
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