MCP23S09-E/P vs MAX7329AWE+ feature comparison

MCP23S09-E/P Microchip Technology Inc

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MAX7329AWE+ Maxim Integrated Products

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code DIP SOIC
Package Description 0.300 INCH, LEAD FREE, PLASTIC, DIP-18 0.300 INCH, LEAD FREE, MS013AA, SOIC-16
Pin Count 18 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Clock Frequency-Max 10 MHz
External Data Bus Width
JESD-30 Code R-PDIP-T18 R-PDSO-G16
JESD-609 Code e3 e3
Length 22.86 mm 10.3 mm
Number of Bits 8 8
Number of I/O Lines 8 8
Number of Ports 1 1
Number of Terminals 18 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP18,.3 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm 2.65 mm
Supply Current-Max 1 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 1.8 V 2.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS BICMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.5 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 1 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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