MCP2515-I/ML
vs
MCP2515-E/SORB4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
4 X 4 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, QFN-20
|
SOIC-18
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Address Bus Width |
|
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
SPI
|
SPI
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| Communication Protocol |
SYNC; BIT ;BYTE
|
SYNC; BIT ;BYTE
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQCC-N20
|
R-PDSO-G18
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
11.55 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
20
|
18
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
SOP18,.4
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (words) |
14
|
|
| Seated Height-Max |
1 mm
|
2.65 mm
|
| Supply Current-Max |
10 mA
|
10 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4 mm
|
7.5 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, CAN
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare MCP2515-I/ML with alternatives
Compare MCP2515-E/SORB4 with alternatives