MCP2542FDT-H/MNY
vs
TJA1042TK/3
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Package Description |
HVSON,
|
HVSON, SOLCC8,.12,25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Date Of Intro |
2016-03-03
|
|
| Samacsys Manufacturer |
Microchip
|
NXP
|
| Data Rate |
8000 Mbps
|
5000000 Mbps
|
| JESD-30 Code |
R-PDSO-N8
|
S-PDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.12,20
|
SOLCC8,.12,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
1 mm
|
| Supply Current-Max |
140 mA
|
70 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
CAN FD TRANSCEIVER
|
CAN FD TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
3 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SON
|
| Pin Count |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare MCP2542FDT-H/MNY with alternatives
Compare TJA1042TK/3 with alternatives