MCP2558FD-H/MNY
vs
PCA82C250T/N4,115
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Package Description |
HVSON,
|
3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT96-1, SOP-8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2016-03-30
|
|
JESD-30 Code |
R-PDSO-N8
|
R-PDSO-G8
|
Length |
3 mm
|
4.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
105 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
0.8 mm
|
1.75 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
SOT96-1
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Number of Transceivers |
|
1
|
Package Equivalence Code |
|
SOP8,.25
|
Qualification Status |
|
Not Qualified
|
Technology |
|
BICMOS
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
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