MCP2558FD-H/MNY vs PCA82C250TD feature comparison

MCP2558FD-H/MNY Microchip Technology Inc

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PCA82C250TD Philips Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC PHILIPS SEMICONDUCTORS
Package Description HVSON,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-03-30
JESD-30 Code R-PDSO-N8 R-PDSO-G8
Length 3 mm
Number of Functions 1
Number of Terminals 8 8
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Screening Level TS 16949
Seated Height-Max 0.8 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT CAN TRANSCEIVER
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 2 mm
Base Number Matches 1 2
Rohs Code Yes
Number of Transceivers 1
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Current-Max 70 mA
Technology BICMOS

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