MCP6002T-E/MS
vs
MCP6002T-I/SN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Part Package Code |
MSOP
|
|
| Package Description |
PLASTIC, MSOP-8
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Common-mode Reject Ratio-Min |
60 dB
|
|
| Common-mode Reject Ratio-Nom |
76 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
4500 µV
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
|
| Low-Bias |
NO
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
SOLCC8,.11,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TAPE AND REEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
|
| Slew Rate-Nom |
0.6 V/us
|
|
| Supply Current-Max |
0.34 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Unity Gain BW-Nom |
1000
|
|
| Voltage Gain-Min |
25118.86
|
|
| Wideband |
NO
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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