MCP6002T-E/P
vs
TLV6002IDGKR
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
VSSOP-8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Date Of Intro |
|
2016-06-19
|
Samacsys Manufacturer |
|
Texas Instruments
|
Average Bias Current-Max (IIB) |
|
0.000076 µA
|
Bias Current-Max (IIB) @25C |
|
0.000076 µA
|
Common-mode Reject Ratio-Min |
|
60 dB
|
Common-mode Reject Ratio-Nom |
|
76 dB
|
Input Offset Voltage-Max |
|
4500 µV
|
JESD-30 Code |
|
S-PDSO-G8
|
JESD-609 Code |
|
e4
|
Length |
|
3 mm
|
Moisture Sensitivity Level |
|
2
|
Neg Supply Voltage Limit-Max |
|
-3.5 V
|
Number of Functions |
|
2
|
Number of Terminals |
|
8
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TSSOP
|
Package Shape |
|
SQUARE
|
Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.1 mm
|
Slew Rate-Nom |
|
0.5 V/us
|
Supply Current-Max |
|
0.2 mA
|
Supply Voltage Limit-Max |
|
3.5 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Unity Gain BW-Nom |
|
1000
|
Width |
|
3 mm
|
|
|
|
Compare MCP6002T-E/P with alternatives
Compare TLV6002IDGKR with alternatives