MCP6002T-I/SL
vs
TLV6002QDGKRQ1
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
SOP,
|
VSSOP-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Nom |
76 dB
|
76 dB
|
| Input Offset Voltage-Max |
4500 µV
|
4500 µV
|
| JESD-30 Code |
R-PDSO-G14
|
S-PDSO-G8
|
| Length |
8.65 mm
|
3 mm
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Slew Rate-Nom |
0.6 V/us
|
0.5 V/us
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1000
|
1000
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2018-12-15
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Average Bias Current-Max (IIB) |
|
0.000076 µA
|
| Bias Current-Max (IIB) @25C |
|
0.000076 µA
|
| Common-mode Reject Ratio-Min |
|
60 dB
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
0.2 mA
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD SILVER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP6002T-I/SL with alternatives
Compare TLV6002QDGKRQ1 with alternatives