MCP6002T-I/SNVAO
vs
MCP6002-E/ST
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SOP, SOP8,.25
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
|
Common-mode Reject Ratio-Min |
60 dB
|
|
Common-mode Reject Ratio-Nom |
76 dB
|
76 dB
|
Frequency Compensation |
YES
|
|
Input Offset Voltage-Max |
4500 µV
|
4500 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
|
Length |
4.9 mm
|
5 mm
|
Low-Bias |
YES
|
|
Low-Offset |
NO
|
|
Micropower |
YES
|
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Power |
NO
|
|
Programmable Power |
NO
|
|
Screening Level |
AEC-Q100; TS 16949
|
|
Seated Height-Max |
1.75 mm
|
1.2 mm
|
Slew Rate-Nom |
0.6 V/us
|
0.6 V/us
|
Supply Current-Max |
0.34 mA
|
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
1000
|
1000
|
Voltage Gain-Min |
25118.86
|
|
Wideband |
NO
|
|
Width |
3.9 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MCP6002T-I/SNVAO with alternatives
Compare MCP6002-E/ST with alternatives