MCP601-I/SN
vs
TLR341G-TR
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
ROHM CO LTD
|
Package Description |
PLASTIC, SOIC-8
|
LSSOP,
|
Reach Compliance Code |
unknown
|
compliant
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Common-mode Reject Ratio-Nom |
90 dB
|
90 dB
|
Input Offset Voltage-Max |
2000 µV
|
4500 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G6
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
6
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
|
Slew Rate-Nom |
2.3 V/us
|
1.2 V/us
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Unity Gain BW-Nom |
2800
|
2300
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Average Bias Current-Max (IIB) |
|
0.0002 µA
|
Length |
|
2.9 mm
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
1.25 mm
|
Terminal Pitch |
|
0.95 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
1.6 mm
|
|
|
|
Compare TLR341G-TR with alternatives