MCP6022T-I/P
vs
TLV9062IDGKT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
TSSOP,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00015 µA
|
5e-7 µA
|
| Common-mode Reject Ratio-Nom |
90 dB
|
103 dB
|
| Input Offset Voltage-Max |
500 µV
|
1600 µV
|
| JESD-30 Code |
R-PDIP-T8
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
9.46 mm
|
3 mm
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.32 mm
|
1.1 mm
|
| Slew Rate-Nom |
7 V/us
|
6.5 V/us
|
| Supply Voltage Limit-Max |
7 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
10000
|
10000
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2017-09-27
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Common-mode Reject Ratio-Min |
|
80 dB
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
1.5 mA
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP6022T-I/P with alternatives
Compare TLV9062IDGKT with alternatives