MCP602T-I/SN
vs
MCP602-I/SNG
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PLASTIC, SOIC-8
|
SOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Nom |
90 dB
|
90 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
2000 µV
|
3000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TAPE AND REEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Nom |
2.3 V/us
|
2.3 V/us
|
| Supply Current-Max |
0.65 mA
|
0.65 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
2800
|
2800
|
| Voltage Gain-Min |
56200
|
56200
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Average Bias Current-Max (IIB) |
|
0.00006 µA
|
| Common-mode Reject Ratio-Min |
|
75 dB
|
| JESD-609 Code |
|
e3
|
| Length |
|
4.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Wideband |
|
NO
|
| Width |
|
3.91 mm
|
|
|
|
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